Take the RevCon challenge!
With support from the Defense Advanced Research Projects Agency (DARPA), the MU College of Engineering will host the 2014 International Field-Reversible Thermal Connector (RevCon) Challenge led by Professors C. L. Chen and Gary Solbrekken in the Department of Mechanical and Aerospace Engineering. The college is inviting research groups from all over the world to consider putting together a team and taking part in the challenge. Click here for the announcement and all challenge details.
The RevCon Challenge is open to all college student design teams interested in thermal connector innovations to propose and evaluate novel design concepts. Student teams should consist of at least two students plus faculty mentors. Advanced graduate students and post-doctoral researchers also can serve as effective mentors. The letters of intent are due Oct. 15, 2013, and full proposals must be submitted by 12 p.m. EST on Nov. 22, 2013.
“We are hoping through this grand challenge to generate worldwide interest in this topic to further develop an exciting field,” said Chen.
Please forward this announcement to others who may be interested in this initiative. For more information, email: firstname.lastname@example.org.