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Innovative process seeks to cool very hot components in very small spots

C.L. Chen has been at the forefront of thermal management and microfluidic technology for “hot” electronic devices for years. It was part of his research during his time as department manager and founder of Applied Computational Physics and Thermal and Flow Physics at Teledyne Scientific and Imaging. And it has remained at the core of his work since he joined the MU Mechanical and Aerospace Engineering Department faculty as a professor and director of the Aero, Thermal, Fluid and Energy Laboratory in 2011.

Top student teams take aim at RevCon Challenge

The 4th Annual International Field-Reversible Thermal Connector [RevCon] Challenge, sponsored by the Defense Advanced Research Projects Agency [DARPA], was held Oct. 23 at the Reynolds Journalism Institute and Lafferre Hall on the campus of the University of Missouri.

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