College of Engineering faculty recently received an award from the Office of Naval Research Defense University Research Instrumentation Program (DURIP) to purchase and assemble a particle image velocimetry (PIV) system.
C.L. Chen has been at the forefront of thermal management and microfluidic technology for “hot” electronic devices for years. It was part of his research during his time as department manager and founder of Applied Computational Physics and Thermal and Flow Physics at Teledyne Scientific and Imaging. And it has remained at the core of his work since he joined the MU Mechanical and Aerospace Engineering Department faculty as a professor and director of the Aero, Thermal, Fluid and Energy Laboratory in 2011.
The 4th Annual International Field-Reversible Thermal Connector [RevCon] Challenge, sponsored by the Defense Advanced Research Projects Agency [DARPA], was held Oct. 23 at the Reynolds Journalism Institute and Lafferre Hall on the campus of the University of Missouri.
Seven teams of graduate and undergraduate students demonstrated field-reversible thermal connectors designed for the demanding world of high-power military electronics at the 2014 International Field-Reversible Thermal Connector Challenge.
On Oct. 31, seven university teams will demonstrate the prototypes of the thermal connectors they’ve designed to judges at the University of Missouri College of Engineering, the hosting agency for the 2014 and 2015 International Field-Reversible Thermal Connector (RevCon) Challenge.
A paper submitted to an American Society of Mechanical Engineer’s international conference in December 2013 received the conference’s Best Paper Award.
With support from the Defense Advanced Research Projects Agency (DARPA), the MU College of Engineering will host the 2014 International Field-Reversible Thermal Connector (RevCon) Challenge led by Professors C. L. Chen and Gary Solbrekken in the Department of Mechanical and Aerospace Engineering.